Machine for the WSP (Wafer Scale Package): Model NK8808L
Features of NK8808L
- Machine is specialized for the WSP (Wafer Scale Package)
- Total process System: Picking Die up from Wafer -> Quality (Appearance) Inspection and Alignment with Cameras -> Tape & Reel
- Smooth Handling of Die (No pressure or damage on Die)
- Extra small Die (up to 0.5mm square) can be applied with the Full Vision support and accurate mechanism.
- Can be applied in various ways, such as Wafer to Tape, Wafer to Tray, Tray to Tape, Tape to tape/Tray (de-taping)
- Wafer Auto laoding system is provided
Download Catalog: NK8808L
NK8808L Catalog PDF (112KB)
Major Specifications
| Productivity | 7,000 Units / hour (0.55 sec./unit) |
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| Applicable range of Carrier tape size | Width: 8mm & 12mm (16mm option) |
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| Embossed tape pitch | Pocket Pitch: 2, 4 & 8mm (12mm option) |
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| Applicable size of Wafer Ring | 8 inches |
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| Capable numbers of Wafer Rings at Wafer Loader | Max. 25 rings |
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| Wafer Auto Loader | Provided |
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